[PDF.13sg] Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis (Mechanical Engineering (Marcel Dekker))
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis (Mechanical Engineering (Marcel Dekker))
[PDF.vo53] Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis (Mechanical Engineering (Marcel Dekker))
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| #5399241 in Books | CRC Press | 2002-10-08 | Original language:English | PDF # 1 | .59 x6.32 x9.42l,.0 | File type: PDF | 224 pages | ||3 of 3 people found the following review helpful.| In Need of a revision!!|By Reviewer|This book was very helpful in providing an overview of performing a first-order thermal analysis. The book is very easy to read and understand for basic understanding. Nevertheless, this book has its flaws for practical use.
Most practical texts should provide charts and tables to calculate basic losses for convection, for exampl||Anyone looking to learn quickly about the fundamentals of basic thermal heat transfer and vibration needs this book. The author has written a concise practical book intended for all engineers who need to understand the fundamentals of heat transfer and mechani
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.
Practical Guide to the Packaging of Electronics discusses
Packaging/enclosure design and reliability <...
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